PCB SolderMask-Finished Pattern Inspection system

Performance

Automatic load/unload the material

Set up and automatic load/unload the material.

Quickly set up

Parameter setting is easy, set the parameters time is less than 5 minutes, get the new part no. to start inspection, no more than 5 minutes.

Inspection the type of defect

• Line below the solder mask layer: irregular rupture / link.
• Bond Finger：nickel layer thickness is insufficient.
• Bonding Finger size
• Copper-clad surface：gold misplating, Scratches dent, missing, poor printed, contaminants.
• Solder mask smear
• Solder mask：Foreign object, scratches, crack.
• Solder ball：solder ball scratches

Function of Design Rule Check

To determine defect by user's parameters and system embedded logic. Simple operation and no need reference required.

Function of laser marking defects

Marking defect distribution location, laser indicator, output defect distribution map, coordinate's file.

Purpose

Inspect defects on the PCB by optical lens capturing system. The inspection system can reduce damages and promote product quality.

Operating principle

Analog microscope to take the principle of image, the use of high-energy front projection, side projection light source to be inspected, through the precision optical lens group, focusing to the top of the high-resolution sensor system to obtain images, and then use the computer to convert the image into digital values, then use the following model to identify defects.

• Die To Die design rule check mode: the use of product array arrangement of repeatability, for the same area of the capture image, two-image contrast, to find defects.
• Golden Sample Detection Mode: for the same area of the capture image, select the best sample, two-image contrast, to accurately identify defects, Compared to Die To Die design rule check mode, the function is more powerful, accurate, the best sample can also be used repeatedly.