| Model | DVI-M1 | DVI-P2 | DVI-A3 | GTS-V2 |
|---|---|---|---|---|
| Inspection mode | IC Substrate (BGA, CSP, FC, etc.), HDI | |||
| Type of defect | Not covered with solder mask area line: Bond-Finger / PAD of size inspect, gold-plating surface is bad, gold misplating, foreign object, defect, shifted, Deep Scratch, contamination, the minimum line width inspection, the minimum line space inspection.
Defects below the solder mask layer: short circuit, open circuit, poor filling. |
|||
| The min. line/space width of inspecting | 15um | |||
| Resolution | 5.5 um/pixel ~1.5 um/pixel | 5.16-1.55um/pixel | ||
| Inspection mode | Die To Die, Die To Golden | |||
| Object type | Unit / Strip | Panel / Unit / Strip | Unit / Strip | Unit / Strip |
| Object size (mm) | 300x200 | 945x790 | 300x200 | 610x520 |
| Inspection range | 300x200 | 880x700 | 300x200 | 360x360 |
| Test time(sec) @275*75mm | <30s@ 2.75um/pixel | <30s@ 2.75um/pixel | ||
| Automatically flipped | ||||
| Automatic load/unload the material | ||||