PCB SolderMask-Finished Pattern Inspection system

Application

Finished product inspection (printed circuit board)

Performance

Quickly setup

Parameter setting is easy, set the parameters time is less than 5 minutes, get the new part no. to start inspection, no more than 5 minutes.

Smaller system dimension

Smaller system dimension which won’t waste the install area and suitable for pre-shipment sampling and suitable for pre-purchase sampling.

Inspection the type of defect

Our company has been independent development of software, with more than 20 years of experience, even after the sale of products, but also continue to help customers update the software and optimize the system.

• Line below the solder mask layer: irregular rupture.
• Bond Finger：nickel layer thickness is insufficient.
• Bonding Finger size
• Copper-clad surface：gold misplating Scratches, dent, missing, poor printed contaminant .
• Solder mask smear
• Solder mask：Foreign object Scratches, Crack, Crease
• Solder ball：solder ball scratches

Function of Design Rule Check

To determine defect by user's parameters and system embedded logic. Simple operation and no need reference required

Function of laser marking defects

Marking defect distribution location, laser indicator, output defect distribution map, coordinate's file.

• Die To Die design rule check mode: the use of product array arrangement of repeat ability, for the same area of the capture image, two-image contrast, to find defects.
• Golden Sample Detection Mode: for the same area of the capture image, select the best sample, two-image contrast, to accurately identify defects, Compared to Die To Die design rule check mode, the function is more powerful, accurate, the best sample can also be used repeatedly.

Purpose

Inspect defects on the PCB by optical lens capturing system. The inspection system can reduce damages and promote product quality.

Operating principle

Analog microscope to take the principle of image, the use of high-energy front projection, side projection light source to be detected, through the precision optical lens group, focusing to the top of the high-resolution sensor system to obtain images, and then use the computer to convert the image into digital values, then use the following model to identify defects.

• Die To Die mode: the use of product array arrangement of repeat ability, for the same area of the capture image, two-image contrast, to find defects.
• Golden Sample Detection Mode: for the same area of the capture image, select the best sample, two-image contrast, to accurately identify defects, Compared to Die To Die design rule check mode, the function is more powerful, accurate, the best sample can also be used repeatedly.